Echelon FT 3150 Smart Transceiver Manual de usuario Pagina 138

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Appendix C - Design and Handling Guidelines
132 FT 3120 / FT 3150 Smart Transceiver Data Book
Figure C.4 Switching Currents for C
L
< 5pF
Figure C.5 Switching Currents for C
L
= 50pF
Board Soldering Considerations
Soldering Through-hole Parts (FT-X1)
Please refer to individual Users Guides and Data Books for product-specific details. All through-hole parts should be
soldered using a standard through-hold method with lead temperatures of 250ºC maximum for 5 seconds for both
non-RoHS and RoHS parts.
BUFFERED DEVICE: INPUT t
r
, t
f
500ns, C
L
< 5pF
I
GND
I
CC
V
out
I
GND
I
CC
V
out
BUFFERED DEVICE: INPUT t
r
, t
f
500 ns, C
L
< 50pF
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